NanoSlic Gold stencils are the most advanced solder paste stencils available today.Advanced chemistry has been developed to impart a highly Hydrophobic and Oleophobic surface to the apertures and contact side of the stencil.This non-stick surface resists solder paste build-up, significantly reducing the frequency of cleaning.The Nano coating bonds to the aperture walls regardless of size or geometry. The NanoSlic Gold coating improves paste release, enabling high yield printing with all area ratios.
| Minimum Area Ratio(AR) | ||
|---|---|---|
| Material | Without Coating | With NanoSlic CoatingTM |
| SlicTm
(2-5 micron grain size) |
0.66 | 0.55 |
| UltraSlicTm
(1-2 micron grain size) |
0.60 | 0.48 |
| *Lower area ratios can be achieved deparing depending upon the application. | ||
NanoSlic Gold has a robust, abrasion resistant surface that stands up to repeated cleaning. Under normal printing conditions, the coating will provide long lasting benefits. There are no issues with contamination or long term reliability of the printed not conductive, and chemically inert.
