APERTRONICS as the technical ability to manufacture step stencils in both single and multi-process with new technology. Today's complex PCBs with their various and multi-process with new technology. Today's complex PCBs with their variousand multi-process with new technology. Today's complex PCBs with their various on the same stencil, this allows the ability to control solder paste deposition in fine pitch areas while printing sufficient solder on coarse pitch areas.

We are having chemical etching and new generation technology for step stencils.

Benefits:

• Step stencils provide optimum solder paste volume control.
• Multiple steps can be achieved including a step on the squeegee side and relief on the board side on the same stencil.
• Stencils with relief pocket-step in the area of protrusions will solve the problem of gasketing, paste smearing, and the risk of electrical short.
• Step stencils can eliminate two print processes in some cases (when some components on the same board need higher paste height/volume compared with other areas).
• A single step stencil can replace multiple stencils (using the step process we can have multiple images at a different thickness on the same stencil)